Mobile
operators have long been concerned with the measurement and mitigation of
passive intermodulation (PIM). Depending on the technology being deployed, for
example FDD vs TDD systems, sensitivity to PIM may vary. But PIM levels on
antenna PCBs can need to be as low as -163dBc or better, which places strict
demands on the materials being used, PCB fabrication, and the measurement
systems employed to quantify PIM.
This
presentation will review:
• A basic overview of PIM
• Different test methods and parameters
for measuring PIM
• The impact on PIM of antenna designs,
dielectric materials, copper foils and PCB fabrication processes
• Examples of PIM levels using different
materials and future developments